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Supported Nodes
180nm
130nm
110nm
90nm
65nm
45nm
portable to ≤ 40nm
Partners

alchip

alchip Logo

alchip alchip

ARM

ARM Logo

ARM ARM

Chip Estimate

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Chip Estimate Chip Estimate

Constellations

Constellations Logo

Constellations Constellations

D and R

D and R Logo

D and R D and R

eSilicon

eSilicon Logo

eSilicon eSilicon

Faraday

Faraday Logo

Faraday Faraday

GSA

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GSA GSA

Mentor

Mentor Logo

Mentor Mentor

NSW

NSW Logo

NSW NSW

Toppan

Toppan Logo

Toppan Toppan
Supported Foundries

UMC

UMC Logo

UMC UMC

Tower

Tower Logo

Tower Tower

Fujitsu

Fujitsu

Fujitsu Fujitsu

SMIC

SMIC Logo

SMIC SMIC

TSMC

TSMC

TSMC TSMC
Logic NVM, Embedded NVM, OTP Memory
Technology
Sidense one-time programmable (OTP) products are built using a patented 1T-Fuse™ architecture, delivering the industry's smallest footprint, lowest power, highest performance and most reliable OTP.    Learn More
one time programmable non volatile memory for electronic products
Applications
Sidense Logic NVM IP is broadly applied in: digital consumer, mobile, wireless, RFID, code storage, analog trimming, automotive, industrial, configurable processors & logic, and medical applications.   Learn More
standard CMOS logic NVM, low power, fast access times, wide array of densities
Products
Sidense: 50% smaller, 80% lower power, 10ns access times, densities to 8Mb, available from 180nm – 65nm at the leading foundries in their standard-logic CMOS processes.    Learn More
Sidense - reliable embedded storage, wide array of densities, non-volatile memory NVM
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Sidense develops industry-leading Logic NVM (Non-Volatile Memory) that helps SoC designers achieve extraordinary results in cost, density, reliability, security and power using standard-logic CMOS processes.

2009 DAC Conference

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Visit Sidense At TSMC Symposiums | Japan July 6th

SIDENSE Exhibits at
TSMC Symposiums Japan

Visit Sidense (Booth 12) on July 6th
TSMC Symposium in Yokohama, Japan 





IEC Executive Perspectives DesignCon 2009 Xerxes Wania, President and CEO

Podcast on IEC  Executive Perspectives  DesignCon 2009  with Xerxes Wania, President and CEO, SIdense Corp.
Abstract - Sidense with Xerxes Wania, President and CEO.
 
 





Sidense Makes the List -- EE Times Updates List of Emerging Startups

Article in EE Times by Peter Clarke,

Abstract -   The list of EE Times 60 Emerging Startups, first published in April 2004, has been updated to version 8.0, reflecting the latest corporate, commercial, technology and market conditions. Twenty-three companies have been brought onto the Silicon 60.  Read the complete story....





Latest Industry Blog on Chip Design, by Jim Lipman, Sidense

Tuning into Jim...
Abstract - Check out Jim’s semiconductor industry commentary on Chip Design's website,  Blog...





Logic NVM Industry Presentations, by Wlodek Kurjanowicz, CTO, Sidense

pdf"Evaluating Embedded Non-Volatile Memory for 65nm and Beyond"... DesignCon 2008




What People Are Saying About Sidense!

Magnum Semiconductor

Magnum Semiconductor

Magnum Semiconductor Magnum Semiconductor

Parkervision

Parkervision

Parkervision Parkervision

SLI

SLI

SLI SLI

SMIC

SMIC

SMIC SMIC

UMC

UMC

UMC UMC

ViXS

ViXS

ViXS ViXS