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Page 1 of 5 The NVM Insider
A quarterly look at embedded NVM/OTP happenings
# 3 – March 2009
Executive Opinion: Communication Is King
Tom Schild, Vice President of Worldwide Sales, Sidense
In this economic climate it is difficult to manage new design projects
as priorities are adjusted and schedules changed. But it is also true
if new design efforts were halted today, the negative impact to the
future revenue of a semiconductor company would be devastating. Design
managers are facing tough decisions, including prioritization,
execution, and first-time design effectiveness with their current
design team. These decisions relate directly to picking an IP partner
who can not only cover current design project needs, but also the needs
that future products will require.
Read more
Outside Thoughts: Secure Flexibility for Platform Oriented Architectures
Craig Rawlings, Sr. Director of Product Management, Certicom
The traditional SoC has long viewed the agility of its FPGA neighbor with
envy, even as the FPGA has sought the low unit cost of an SoC. As they
say, the grass is always greener on the other side. While structured
ASICs have labored to keep one foot in the hardwired and programmable
ponds, respectively, these vendors have primarily succeeded in adding
an unacceptable delay in the path from flexibility during prototyping
to low cost in volume production. New Platform Oriented Architecture
(POA) based SoC devices are now enjoying the greater flexibility long
associated with FPGA devices while maintaining their low unit costs.
Read more
Sidense Out and About
Press Releases
Recognition
Editorial Coverage
Sidense Authored Articles
Memberships
Upcoming Conferences/Tradeshows of Interest
New Sidense Partners
New Sidense Foundry Support
NVM on the Mind
Recent Articles
Your Two Bits!
Which foundry are you likely to use for your next design? Which process node are you considering? Select your choice on our online poll. Final results will be posted in the next The NVM Insider.
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