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Page 1 of 5 The NVM Insider
A quarterly look at embedded NVM/OTP happenings
# 4 – June 2009
Executive Opinion: Making Service a Key Component of "Value Added"
Rhéal Gervais, Vice President of Operations, Sidense
The term "value added" refers to the additional value added to an item's production flow from the initial production of its constituent parts until the final product is in consumers' hands. For a semiconductor-based electronics product, value is added at each stage of product integration, from IP integration on a chip through final component integration into the saleable "box." From a semiconductor IP vendor's viewpoint, adding value to a chip comprises not only the IP they offer but also the service they provide to the IP customer to make sure the chip works to that customer's satisfaction. Very often, this service aspect is what differentiates one IP vendor from all the others.
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Outside Thoughts: The IP Industry: One Big Happy Family
Warren Savage, President and CEO, IPextreme
A great deal is written about vendor consolidation in the semiconductor industry. However, this remains an elusive goal when it comes to IP. As system integration drives ever more complex devices, so does the appetite for a broad range of IP that no single vendor can possibly provide.
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Sidense Out and About
Press Releases
Sidense Authored Articles
Editorial Coverage
Upcoming Conferences/Tradeshows of Interest
- TSMC Technology Symposiums
Sidense will be exhibiting at three TSMC Symposiums during June and July:
- Hsin-chu, Taiwan (June 18) – Booth #12
- Shanghai, China (June 25) – Booth #22
- Yokohama, Japan (July 6) – Booth #TBD
Contact Tom Schild (425-422-7376,
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) if you would like to arrange a meeting at one of these shows.
- Design Automation Conference (DAC)
Sidense will also be attending DAC in San Francisco, CA (July
26-30). We will be giving presentations at the Chip Estimate booth
(#1100) Monday through Wednesday at 2PM.
Contact Jim Lipman (925-606-1370,
This e-mail address is being protected from spam bots, you need JavaScript enabled to view it
) to arrange a meeting at DAC.
- Flash Memory Summit
Sidense will be presenting a paper at the Flash Memory Summit – Santa Clara, CA (Aug. 11-13). The presentation, A Novel Embedded OTP Memory Bit Cell Based on Oxide Breakdown
will be at the Life Beyond Flash: New Non-Volatile Memory Technologies
session taking place from 8:30AM to 9:40AM on Thursday, Aug. 13.
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Recent Articles
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