"By qualifying our IP in UMC's 130nm standard logic CMOS process, we have taken another step in providing our customers with low-cost, embedded, non-volatile memory IP for their mainstream chips," said Xerxes Wania, President and CEO of Sidense. "Our 1T-Fuse™ based Logic NVM cores are among the fastest, most secure and smallest available, giving chip designers the ability to put inexpensive field-programmable storage on their chips for a variety of low and high bit-count applications."
"We are delighted to add Sidense's memory offerings to UMCs IP Alliance Program. Sidense's embedded memory gives our customers an excellent embedded storage capability for their chips, available on a fully qualified UMC process," said Ken Liou, director of the IP and Design Support division at UMC. "As SoC storage requirements continue to rise, secure embedded NVM will become increasing important for many applications, such as those in the consumer and automotive markets."
Sidense's 1T-Fuse Logic NVM IP is based on a one-time programmable (OTP) technology that is one of the smallest and fastest in the industry. It requires no additional mask layers or process steps and is portable across several different technology nodes and foundries. Furthermore, the OTP can be programmed in the field, during wafer or production testing. Sidense's products are targeted to standard logic digital CMOS processes that are 180nm, 130nm, 90nm, 65nm and smaller at several well-known foundries. Ideal applications include electrical fuse replacement, flash and mask-programmable ROM replacement, code storage, RFID, unique ID, encryption, key storage, HDMI and digital rights management (DRM).
Sidense provides secure, dense and reliable non-volatile one-time programmable (OTP) memory IP cores for use in standard-logic CMOS processes, with no additional masks or process steps required. The memory is portable across several different technology nodes and foundries, and can be programmed in the field or during wafer or production testing. The company has offices in Mississauga and Ottawa, Canada and sales offices in San Francisco, CA and Tokyo, Japan. For more information, visit www.sidense.com.
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that manufactures advanced system-on-chip (SoC) designs for applications spanning every major sector of the IC industry. UMC's SoC Solution Foundry strategy is based on the strength of the company's advanced technologies, which include production proven 90nm, 65nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 12,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at www.umc.com.