NVM Insider Issue #3
| Index |
|---|
| The NVM Insider, Issue 3 |
| Page 2 - Executive Opinion |
| Page 3 - Outside Thoughts |
| Page 4 - NVM on the Mind |
| All Pages |
March 2009
A quarterly look at embedded NVM/OTP happenings
Executive Opinion: Communication Is King
Tom Schild, Vice President of Worldwide Sales, Sidense
In this economic climate it is difficult to manage new design projects as priorities are adjusted and schedules changed. But it is also true if new design efforts were halted today, the negative impact to the future revenue of a semiconductor company would be devastating. Design managers are facing tough decisions, including prioritization, execution, and first-time design effectiveness with their current design team. These decisions relate directly to picking an IP partner who can not only cover current design project needs, but also the needs that future products will require.
Outside Thoughts: Secure Flexibility for Platform Oriented Architectures
Craig Rawlings, Sr. Director of Product Management, Certicom
The traditional SoC has long viewed the agility of its FPGA neighbor with envy, even as the FPGA has sought the low unit cost of an SoC. As they say, the grass is always greener on the other side. While structured ASICs have labored to keep one foot in the hardwired and programmable ponds, respectively, these vendors have primarily succeeded in adding an unacceptable delay in the path from flexibility during prototyping to low cost in volume production. New Platform Oriented Architecture (POA) based SoC devices are now enjoying the greater flexibility long associated with FPGA devices while maintaining their low unit costs.
Sidense Out and About
Press Releases
- Sidense OTP for Low-Power 90nm Implementation was selected by Fujitsu Microelectronics
- IPextreme Levels the Playing Field with Constellations™ Program
Recognition
- EE Times list of Top 60 Startups
- OCRI (Ottawa Centre for Research and Innovation) Finalist – Best Financial Deal category
Editorial Coverage
Sidense Authored Articles
-
Foundry-Friendly Memory IP for Analog Trimming and Sensor Calibration
GSA Forum (March 2009)
Memberships
Upcoming Conferences/Tradeshows of Interest
New Sidense Partners
New Sidense Foundry Support
NVM on the Mind
Recent Articles
-
Universal memory race still on the starting block
Mark LaPedus and Dylan McGrath, EE Times (December 19, 2008)
Your Two Bits!
Which foundry are you likely to use for your next design? Which process node are you considering? Select your choice on our online poll. Final results will be posted in the next The NVM Insider.