The NVM Insider, Issue 4 - Page 4 - NVM on the Mind

Index
The NVM Insider, Issue 4
Page 2 - Executive Opinion
Page 3 - Outside Thoughts
Page 4 - NVM on the Mind
All Pages
Page 4 of 4

Sidense Out and About

Press Releases

Sidense Authored Articles

Editorial Coverage

Upcoming Conferences/Tradeshows of Interest

  • TSMC Technology Symposiums
    Sidense will be exhibiting at three TSMC Symposiums during June and July:
    • Hsin-chu, Taiwan (June 18) – Booth #12
    • Shanghai, China (June 25) – Booth #22
    • Yokohama, Japan (July 6) – Booth #TBD
    Contact Tom Schild (425-422-7376, This e-mail address is being protected from spambots. You need JavaScript enabled to view it ) if you would like to arrange a meeting at one of these shows.
  • Design Automation Conference (DAC)
    Sidense will also be attending the DAC in San Francisco, CA (July 26-30). We will be giving presentations at the Chip Estimate booth (#1100) Monday through Wednesday at 2PM.
    Contact Jim Lipman (925-606-1370, This e-mail address is being protected from spambots. You need JavaScript enabled to view it ) to arrange a meeting at DAC.
  • Flash Memory Summit
    Sidense will be presenting a paper at the Flash Memory Summit – Santa Clara, CA (Aug. 11-13). The presentation, A Novel Embedded OTP Memory Bit Cell Based on Oxide Breakdown will be at the Life Beyond Flash: New Non-Volatile Memory Technologies session taking place from 8:30AM to 9:40AM on Thursday, Aug. 13.

NVM on the Mind

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