Support & Resources

September 2011

A quarterly look at embedded NVM/OTP happenings


Xerxes Wania, President and CEO, Sidense

Executive Opinion: A Message From The CEO

Xerxes Wania, President and CEO, Sidense

Dear Customers, Partners and Suppliers,

During the past few weeks there has been a lot of confusing information regarding the Kilopass versus Sidense lawsuit. We would like to share our progress by pointing to certain facts that may help you understand the case better. Sidense believes it is winning its dispute with Kilopass, both in the Court and at the USPTO.

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Kurt Shuler, VP of Marketing, Arteris

Outside Thoughts: Embedded Device Security and the Challenge of On-Chip Communication

By Kurt Shuler, VP of Marketing, Arteris

There isn't a day that goes by where we do not see a report about another mobile phone or other consumer electronics device being successfully hacked for nefarious purposes. The popularity of Apple's iPhone and phones based on Google's Android OS has made these devices an inviting target for credit card thieves, warez purveyors and even corporate spies. Our industry has responded with a layered defense consisting of both hardware and software. But new technology is enabling security schemes to be implemented at the system-on chip (SoC) interconnect level.

At the most base level, security starts when the phone or other electronic device is booted or turned on. One standard booting procedure used in most phones is called a "two stage" boot process. In this boot process, there is a first stage where the device boots by sending boot information from an internal read-only memory (ROM), non-volatile memory (NVM) or one-time programmable (OTP) memory to an internal static RAM (SRAM). This internal RAM is too small to hold all the required boot code, so its job is to cross load a larger set of boot code in a second stage. It is this second stage boot process that starts the device's operating system.

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Tech Tidbits

Tech Tidbits: Sidense ULP 1T-OTP for Trimming and Calibrating Low-Power Devices

Craig Downing, Product Marketing Manager and Jim Lipman, Director of Marketing, Sidense

Analog ICs, sensors and mixed-signal SoCs that include analog circuitry need to meet precise specifications for analog signal behavior. To compensate for variations in chip processing and the effects of packaging, analog circuitry needs to be trimmed by adjusting part of the circuitry. Many devices such as silicon clocks, RFID chips and other devices used in applications such as mobile handsets also have very demanding requirements for low power consumption to maximize battery life or to operate within a very limited power budget.

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Sidense Out and About

Press Releases

Articles

Visit Sidense at the Upcoming Conferences and Tradeshows

  • Open Innovation Platform (OIP) Ecosystem Forum Partner Pavilion on the following date:

    Tuesday, Oct. 18
    San Jose Convention Center, 150 West San Carlos St., San Jose, CA 95110

    Sidense exhibiting in Booth 215 from 8:00AM to 6:30PM
    Sidense is speaking at 2PM on &quote;An Essential 1T-OTP NVM Component for IC Design&quote;

    To schedule a meeting at the OIP Ecosystem Forum in San Jose, please contact Jim Lipman at This email address is being protected from spambots. You need JavaScript enabled to view it..
  • Technology Symposium - Yokohama, Japan on the following date:

    Monday, November 28
    Pan Pacific Yokohama Bay Hotel Tokyu, 2-3-7, Minato Mirai, Nishi-ku, Yokohama, Kanagawa, Japan 220-8543

    Sidense exhibiting from 9AM to 5:30PM

    To schedule a meeting at the TSMC Technology Symposium in Yokohama, please contact Kazuaki Okawa at This email address is being protected from spambots. You need JavaScript enabled to view it..

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