A quarterly look at embedded NVM/OTP happenings
Executive Opinion: A Message From The CEO
Xerxes Wania, President and CEO, Sidense
Dear Customers, Partners and Suppliers,
During the past few weeks there has been a lot of confusing information regarding the Kilopass versus Sidense lawsuit. We would like to share our progress by pointing to certain facts that may help you understand the case better. Sidense believes it is winning its dispute with Kilopass, both in the Court and at the USPTO.
Outside Thoughts: Embedded Device Security and the Challenge of On-Chip Communication
By Kurt Shuler, VP of Marketing, Arteris
There isn't a day that goes by where we do not see a report about another mobile phone or other consumer electronics device being successfully hacked for nefarious purposes. The popularity of Apple's iPhone and phones based on Google's Android OS has made these devices an inviting target for credit card thieves, warez purveyors and even corporate spies. Our industry has responded with a layered defense consisting of both hardware and software. But new technology is enabling security schemes to be implemented at the system-on chip (SoC) interconnect level.
At the most base level, security starts when the phone or other electronic device is booted or turned on. One standard booting procedure used in most phones is called a "two stage" boot process. In this boot process, there is a first stage where the device boots by sending boot information from an internal read-only memory (ROM), non-volatile memory (NVM) or one-time programmable (OTP) memory to an internal static RAM (SRAM). This internal RAM is too small to hold all the required boot code, so its job is to cross load a larger set of boot code in a second stage. It is this second stage boot process that starts the device's operating system.
Tech Tidbits: Sidense ULP 1T-OTP for Trimming and Calibrating Low-Power Devices
Craig Downing, Product Marketing Manager and Jim Lipman, Director of Marketing, Sidense
Analog ICs, sensors and mixed-signal SoCs that include analog circuitry need to meet precise specifications for analog signal behavior. To compensate for variations in chip processing and the effects of packaging, analog circuitry needs to be trimmed by adjusting part of the circuitry. Many devices such as silicon clocks, RFID chips and other devices used in applications such as mobile handsets also have very demanding requirements for low power consumption to maximize battery life or to operate within a very limited power budget.
Sidense Out and About
- Sidense's NVM IP Completes TSMC IP9000 Assessment at 90nm Low-Power Process Node (Sept. 12, 2011)
- Markman Ruling Puts Sidense in Strong Position to Win Lawsuit (Sept. 6, 2011)
- Sidense Sues Kilopass and CEO, Charlie Cheng (Sept. 2, 2011)
- USPTO Examiner Maintains Position on Sidense’s ‘855 Patent – Upholding Its Validity Over the Kilopass Peng Patents (Sept. 2, 2011)
- Sidense Completes TSMC IP9000 Assessment for SiPROM NVM IP and Attains more than 70 Customer Licenses in the Last 12 Months (Aug. 2, 2011)
- Activity picks up in non-volatile memory IP
Mike Demler, EE Daily News
Visit Sidense at the Upcoming Conferences and Tradeshows
- Open Innovation Platform (OIP) Ecosystem Forum Partner Pavilion on the following date:
Tuesday, Oct. 18
San Jose Convention Center, 150 West San Carlos St., San Jose, CA 95110
Sidense exhibiting in Booth 215 from 8:00AM to 6:30PM
Sidense is speaking at 2PM on "e;An Essential 1T-OTP NVM Component for IC Design"e;
- Technology Symposium - Yokohama, Japan on the following date:
Monday, November 28
Pan Pacific Yokohama Bay Hotel Tokyu, 2-3-7, Minato Mirai, Nishi-ku, Yokohama, Kanagawa, Japan 220-8543
Sidense exhibiting from 9AM to 5:30PM
Find our IP catalog on ChipEstimate.com.
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