Support & Resources

June 2009

A quarterly look at embedded NVM/OTP happenings

Executive Opinion: Making Service a Key Component of "Value Added"

Rhéal Gervais, Vice President of Operations, Sidense

The term "value added" refers to the additional value added to an item's production flow from the initial production of its constituent parts until the final product is in consumers' hands.  For a semiconductor-based electronics product, value is added at each stage of product integration, from IP integration on a chip through final component integration into the saleable "box."  From a semiconductor IP vendor's viewpoint, adding value to a chip comprises not only the IP they offer but also the service they provide to the IP customer to make sure the chip works to that customer's satisfaction.  Very often, this service aspect is what differentiates one IP vendor from all the others.

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Outside Thoughts:  The IP Industry: One Big Happy Family

Warren Savage, President and CEO, IPextreme

A great deal is written about vendor consolidation in the semiconductor industry. However, this remains an elusive goal when it comes to IP. As system integration drives ever more complex devices, so does the appetite for a broad range of IP that no single vendor can possibly provide.

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Sidense Out and About

Press Releases

Sidense Authored Articles

Editorial Coverage

Upcoming Conferences/Tradeshows of Interest

  • TSMC Technology Symposiums
    Sidense will be exhibiting at three TSMC Symposiums during June and July:
    • Hsin-chu, Taiwan (June 18) – Booth #12
    • Shanghai, China (June 25) – Booth #22
    • Yokohama, Japan (July 6) – Booth #TBD
    Contact Tom Schild (425-422-7376, This email address is being protected from spambots. You need JavaScript enabled to view it. ) if you would like to arrange a meeting at one of these shows.
  • Design Automation Conference (DAC)
    Sidense will also be attending DAC in San Francisco, CA (July 26-30). We will be giving presentations at the Chip Estimate booth (#1100) Monday through Wednesday at 2PM.
    Contact Jim Lipman (925-606-1370, This email address is being protected from spambots. You need JavaScript enabled to view it.) to arrange a meeting at DAC.
  • Flash Memory Summit
    Sidense will be presenting a paper at the Flash Memory Summit – Santa Clara, CA (Aug. 11-13). The presentation, A Novel Embedded OTP Memory Bit Cell Based on Oxide Breakdown will be at the Life Beyond Flash: New Non-Volatile Memory Technologies session taking place from 8:30AM to 9:40AM on Thursday, Aug. 13.

NVM on the Mind

Recent Articles

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