A quarterly look at embedded NVM/OTP happenings
What's Ahead for the Semiconductor Industry
Xerxes Wania, President and CEO, Sidense
As always seems the case, the future of our industry will be full of many surprises. A lot of consolidation will continue to occur as smaller semiconductor and IP companies, lacking marketing and sales resources, will be bought by larger, usually more inefficient companies that are slow in introducing new products. The real interesting story is what is around the corner for semiconductor development.
Outside Thoughts: System OEMs, Moore's Law, and Semiconductor Industry Dynamics
By Kurt Shuler, Vice President of Marketing, Arteris
I've been closely following the increasing power of system OEMs (like Apple, Google, Facebook and Microsoft) over players in the semiconductor industry with an eye toward understanding how this will affect others in the semi value chain. However, I haven't paid as much attention to the root causes of why these changes are occurring. McKinsey & Company has provided our industry food for thought regarding semiconductor industry drivers with this week's McKinsey Insight article, "Moore's law: Repeal or renewal?"
Sidense Out and About
- Another Sidense Win against Kilopass in the U.S Court of Appeals for the Federal Circuit (January 8, 2014)
- Sidense Enjoys Record Fiscal Year 2013 (November 26, 2013)
- Sidense OTP Helps Novatek Provide Customers with Cost-Effective and Reliable Display Drivers
Articles and Whitepapers
- Sidense Beats Kilopass in Court Again! (January 11, 2014)
By Daniel Nenni
- Optimizing Sensor Performance with 1T-OTP Trimming
- Using OTP Memories for High-Performance Video (November 1, 2013)
By Paul McLellan
NVM on the Mind
- Resistive Non-Volatile Memory at IEDM 2013
By Ron Neale, EE Times (Dec. 17, 2013).
As usual, IEDM 2013 provided a shop window for researchers at universities and industry laboratories to present the results of work at the very leading edge of solid-state electronic devices of all types. This report looks at the work on resistive random access memory (ReRAM or RRAM). Papers at IEDM 2013 indicate there is still a list of problems that must be solved before the leading edge becomes commercial product reality, but good progress is being made.
- Magnetic RAM Meets the Power Basics
By Hamilton Carter, Chip Design (Nov. 24, 2013).
As CMOS feature size continues to scale down, power challenges for the technology are scaling up. Increased leakage currents, DRAM refresh rates and the increase in the density of devices, (a double-edged sword), are some of the main contributors to these issues. The following is a brief backgrounder on a technology that has been in the works for almost forty years, the magnetic random access memory (MRAM), which could provide a piece of the puzzle necessary to continue to increased levels of CMOS integration.
- The Persistence of Memory
By Tom Coughlin, Forbes (Nov. 20, 2013).
Flash memory has been showing up in configurations that point to the arrival of persistent memory. Persistent memory retains its data in the host computer even when the power is turned off. Diablo Technology demonstrated flash-based DIMMs in the summer of 2013, a good candidate technology for initial persistent memory products. However flash memory cannot match the data rates that DRAM and especially SRAM (static random access memory) can provide and for this reason flash memory may augment but probably not replace DRAM (dynamic random access memory) and SRAM.
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