A quarterly look at embedded NVM/OTP happenings
Executive Opinion: Our Customers Talk and Sidense Listens
Xerxes Wania, Sidense CEO and President
This past April, Sidense sent a survey to a wide range of its customers. Among the survey's objectives were to evaluate customer satisfaction with Sidense, what our customers consider important in Sidense products and services, and where we can improve our performance and products. The percentage of returned e-surveys was outstanding, indicating a high degree of interest among customers in communicating their opinions to Sidense. Furthermore the overall feedback was very encouraging with 93% of respondents willing to recommend Sidense to others and 88% saying they will license from Sidense in the future - all providing further testimony of our commitment to being "Your Trusted Memory Partner".
Outside Thoughts - IP Goes Vertical
Alan Aronoff, Director of Strategic Business, Imagination Technologies
One of the fundamental pillars of the semiconductor IP value proposition has been based on reducing the cost of SoC development based on simple blocks that can be designed and verified once and reused over and over. In fact, the reusability of IP makes this value proposition possible. Initially, the semiconductor IP industry focused on IP that had the highest levels of reuse including foundation IP such as standard cells and memories, bus standard interfaces such as USB, PCI, etc., and standard computational blocks including CPUs, GPUs, and DSPs. Analog blocks later became important, but do not share the reusability attributes. Porting IP to different processes becomes a cost burden for the IP suppliers.
Outside Thoughts #2 - IoT: The Next Phase
Ian Ferguson, Vice President, Corporate Marketing and Strategic Alliances, ARM
The last NVM Insider outlined several market trends and the role NVM technology has to play as a foundational element in those market solutions. The hype of the "Internet of Things" has moved to practical deployments, especially in industrial applications such as preventative maintenance or energy saving. As Xerxes noted, there is more awareness of the need to secure these connected systems. This is an aspect that ARM is spending a lot of engineering time on in terms of both hardware and software.
Sidense Out and About
Tradeshows and Conferences
Sidense exhibited at Sensors Expo in San Jose this past week. While not a typical show for Sidense participation, it proved to be of tremendous value, providing an opportunity to network with over 300 exhibitors and several thousand attendees, all focused on sensors for IoT, automotive and other markets within the Smart Connected Universe. Sidense saw a lot of booth traffic and the booth staff (Jim Lipman, Mark Davitt and Andrew Faulkner) enjoyed educating visitors on the company, 1T-OTP products and where they fitted within the sensor ecosystem. All-in-all an excellent place to raise awareness of the role of OTP and Sidense in sensor systems.
- Detroit Meets Silicon Valley
Andrew Faulkner and Jim Lipman - Sidense, ChipEstimate (May 17, 2016)
- Moving chips from industrial to industrial IoT
Don Dingee, SemiWiki (May 27, 2016)
- Get ready for hypergrade in automotive
Don Dingee, SemiWiki (April 18, 2016)
- IP Requirements Changing
Brian Bailey, Semiconductor Engineering (Feb. 25, 2016)
NVM on the Mind
- IBM breakthrough gives blistering phase-change memory new practicality
Nick Lavars, gizmag, (May 18, 2016)
- What's Next For NAND?
Mark Lapedus, Semiconductor Engineering (May 18, 2016)
- Power/Performance Bits: April 19
Jesse Allen, Semiconductor Engineering (Apr. 19, 2016)
- New Memory Approaches and Issues
Ed Sperling, Semiconductor Engineering (Mar. 14, 2016)
- MRAM Breakthrough Looms
R. Colin Johnson, EE Times, (Mar. 7, 2016)
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